Google is working on an entirely custom-made chipset. Well, that’s something almost every tech enthusiast would know by now, however, it has been delayed to 2025. Google opted to go with Samsung Semiconductor for its Tenso G3 chipset for Pixel 8 series and Tensor G4 next year will likely remain the same. But you can expect a massive shift in 2025 with future Pixels will use Google’s entirely custom-made SoC dubbed Tensor G5.
According to the reports, Google Pixel 8 series is launching in a few months with Tensor G3 SoC. This is perhaps because it’s too late to change chipsets on smartphones launching a few weeks down the line. Google initially had planned to design Tensor G4 completely in-house for Pixel 10 series. We discovered that Google was using the codename “Redondo” for the chipset. Again, Samsung is likely to get the orders for G4 as well. However, the plans have been scrapped due to high personnel turnover and coordination issues between Indian and American teams at Google.
With that being said, the Tensor G5 chipset is due in 2025. It carries a codename “Laguna” and will mark as the first-ever in-house built chipset from Google. Here, TSMC will likely take the manufacturing ahead. TSMC will use a 3nm process to manufacture G5 SoC for future Pixel devices. One of the primary reasons for Google to design its chipsets is to have better control of the chip which eventually determines how it will compete against other chipsets in real-world tests.
Snapdragon 8 Gen 1 SoC from Qualcomm was fabbed by Samsung Semiconductor and suffered overheating and performance issues. The Redmond-based giant shifted to TSMC for the incremental Snapdragon 8+ Gen 1 SoC later the same year made the chipsets much better and the improvements were significant. With that being said, Google could rope in TSMC to fab its Tensor G5 SoC on its 3nm node. The chipset will power future Pixel phones and foldables as well.
