The Taiwan-based chip manufacturing company MediaTek has released a new entry-level smartphone chipset – the Dimensity 6300 SoC. Announced on April 19, 2024, the chipset offers 10 percent faster CPU performance than its predecessor and over 50 percent “GPU performance advantage versus competitor alternative platforms.”
MediaTek Dimensity 6300 Availability
Per some reports, the upcoming Realme C65 5G could be the first smartphone to feature the Dimensity 6300 SoC.
The precursor to this processor, Dimensity 6100+, powers smartphones like the Redmi 13C 5G, Samsung Galaxy F15 5G, and Realme Narzo 60x 5G. All these models are available for around Rs. 12,000 in India.
MediaTek Dimensity 6300 Specifications
The Dimensity 6300 consists of an octa-core CPU with two Arm Cortex-A76 cores (up to 2.4 GHz) and six Arm Cortex-A55 cores (up to 2.0 GHz). With a higher clock speed, the processor offers more power than the Dimensity 6100+ launched last year.
Further, the 64-bit CPU of the Dimensity 6300 should enhance the performance of entry-level smartphones. It supports LPDDR4X RAM and UFS 2.2 storage, providing a significant performance boost. In terms of graphics, the octa-core CPU is paired with an Arm Mali-G57 MC2 GPU, ensuring a smooth and immersive visual experience.
For optics, the processor supports a native 108MP camera or dual 16MP cameras. In addition, supports a maximum display resolution of 2520 x 1080 pixels (along with a 120Hz refresh rate). Given that the processor is based on TSMC’s 6nm fabrication technology, it should be more efficient than the older models.
Regarding connectivity, the Dimensity 6300 SoC supports 4G, 5G, Wi-Fi 5, Bluetooth v5.2, GPS, and Glonass. The chipset’s maximum download speed is 3.3Gbps. “The Dimensity 6300 features a 3GPP Release-16 standard 5G modem, including the latest connectivity enhancements now deployed by global cellular operators,” says the chipset’s official landing page.
Dimensity 6300 SoC specifications
