MediaTek officially launched the next-generation ‘Dimensity 9300 SoC’ a few days ago. Cut to now, it has announced launching a sub-flagship chipset dubbed as ‘Dimensity 8300’ on November 21 at 15:00 Beijing time with the slogan “Ice Peak Energy Efficiency Super God Evolution”.
MediaTek to launch sub-flagship Dimensity 8300 SoC
The Dimensity 8300 SoC, as per the speculations, packs in a 1+3+4 architecture using ARMv9 cores. Its Prime Cortex-X3 core is clocked at 2.8GHz (1x) plus 3x Cortex-A715 cores clocked at a whopping 2.4gHz, and finally, there are 4x power-efficiency Cortex-A510 cores clocked at 1.6GHz. For comparison, the flagship Dimensity 9300 SoC packs in an octa-core architecture too using 1x Cortex-X4 cores (at 3.25GHz), 3x Cortex-X4 cores (at 2.85GHz), and 4x power-efficiency Cortex-A720 cores at 2.0GHz.
For the unversed, the Dimensity 8300 SoC is a cooled-down version of the Dimensity 9300 SoC and lies almost in parallel with last year’s Dimensity 9200 SoC. The chipset is speculated to be built on TSMC’s N4P 4nm process. Of course, it won’t match the capabilities of DImensity 9300 SoC that powers the latest Vivo X100 Pro let alone the almighty Qualcomm Snapdragon 8 Gen 3 SoC.
Moving further, tech enthusiasts are eagerly waiting for the chipset to drop by on November 21st as it will power a line-up of sub-flagship phones. As of now, there’s nothing much known about the chipset although we should be hoping for an affordable pricing and better value to performance ratio with the same.
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