Samsung is all set to launch two of its foldable offerings at the Galaxy Unpacked event on July 10. A recent report from the Korean publication TheElec says Samsung will integrate a thicker Ultra Thin Glass (UTG) on its foldable display for Galaxy Z Flip6.
Samsung Galaxy Z Flip6 will have thicker ultra-thin glass
The South Korean giant is in line to launch two foldable devices i.e. Z Flip6 and Z Fold6. Talking about the Z Flip6, Samsung will integrate a thicker UTG on top of a foldable display. The current-gen Z Flip5 has a 30-micron thick UTG panel while the upcoming Z Flip6 will get a 50-micron thick UTG panel.
What does this move bring to the table you might ask? With a thicker UTG panel, Samsung is going for a durable design that should withstand the test of time. Samsung wants to minimize the creases and that’s where the thicker UTG panel will play a vital role.
Samsung switched from a traditional hinge to a waterdrop-style hinge for the Galaxy Z Flip5. It will stick to it for the upcoming Z Flip6 as well.
Additionally, we are expecting slimmer bezels and a wider cover display to make it to Z Flip6 as well.
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Samsung Galaxy Z Flip6 Spotted on Geekbench
It is probably the first instance when the yet-to-launch Samsung Galaxy Z Flip6 has been spotted on Geekbench. Bearing model number SM-F956U, the device is paired with Snapdragon 8 Gen 3 SoC under the hood alongside 12GB of RAM. Do note that this doesn’t mean all the regions with get a Snapdragon chipset and rather some will stick to an Exynos equivalent.
The Geekbench listing suggests a score of 1,964 and 6,619 points for single-core and multi-core tests performed on Geekbench v6. The listing does mention a 2+2+3+1 octa-core configuration with a max 3.40GHz frequency.
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