During the Embedded World Exhibition & Conference, Qualcomm Technologies showcased two new chips designed purposefully for IoT and various connected devices, such as robots, drones, cameras, etc. The first product is the QCC730 Wi-Fi Chip, and the second is the RB3 gen 2 Platform. Here’s everything you need to know about both the solutions.
Qualcomm QCC730 Wi-Fi Chip Details And Features
The “disruptive micro-power Wi-Fi system” is designed for IoT connectivity, a group of internet-enabled devices that can share data with each other and function in sync. Compared to its predecessor, the new Wi-Fi chip consumes 88 percent less power, a breakthrough in efficiency. Along with the chip, Qualcomm is also offering an open-source IDE and SDK to develop software around it for better integration across a lineup of IoT devices.
Qualcomm suggests that enterprises use the chip as an alternative to Bluetooth-based IoT devices, which are often slower at communicating and have limited range. The QCC730 also offers advanced cloud connectivity. Along with the chip, the company has also introduced two others, including QCC711 and QCC740. While the former is a tri-core ultra-low power Bluetooth Low Energy SoC, the latter is an all-in-one solution supporting Thread, Zigbee, Wi-Fi, and Bluetooth, making it a versatile option for appliance manufacturers.
Qualcomm RB3 Gen 2 Platform Details And Features
Qualcomm describes the new RB3 Gen 2 Platform as a “comprehensive hardware and software solution designed for IoT and embedded applications.” It offers a combination of high-performance processors with a 10x increase in on-device AI processing. Further, it supports 8MP+ camera sensors and computer vision and comes with integrated Wi-Fi 6E for faster wireless connectivity.
However, unlike the QCC730 Wi-Fi chip, which is built for IoT devices, the RB3 Gen 2 platform is designed for robots, drones, industrial handheld devices, connected cameras, AI edge boxes, and so on. The recently announced Qualcomm AI Hub, which contains a library of AI models, also supports the platform. Per the official press release, RB3 Gen 2 supports Qualcomm Linux, a package of OS, software, and tools designed for Qualcomm Technologies IoT platforms.
Companies interested in the RB3 Gen 2 platform can pre-order it in two integrated development kits. Qualcomm Technology plans to launch an industrial-grade platform soon that focuses on addressing functional safety, environmental, and mechanical handling requirements in industrial applications. The solution should be available in June 2024 and could feature high-performance CPU, GPU, and on-device AI capabilities.
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