TL;DR
- Unlike regular smartphone chipsets, which include a balance of prime, performance, and efficient cores, the Dimensity 8400 SoC features Cortex-A725 cores that can all operate at up to 3.25GHz.
- What’s worth noting is that the processor’s NPU supports LLM, SLM, and LMMs, three different types of language models for on-device AI-enabled features.
For the first time, MediaTek has announced a processor with all prime cores. We’re talking about the Dimensity 8400 SoC, which debuted on December 23, 2024. Featuring a unique cluster design, the processor offers several reasons to upgrade, and here are a few of them.
Dimensity 8400 SoC Features The Big Core Design
First and foremost, the Dimensity 8400 SoC is an octa-core processor that features eight Arm Cortex-A72 performance cores. Yes, that’s right. The company calls this the “All Big Core” design and claims it significantly improves overall performance.
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All The Cores Can Go Up To 3.25GHz
Unlike regular smartphone chipsets, which include a balance of prime, performance, and efficient cores, the Dimensity 8400 SoC features Cortex-A725 cores that can all operate at up to 3.25GHz. While this improves the processor’s multi-core performance by 41%, the chipset also promises a 44% reduction in peak power used (compared to Dimensity 8300).
The chipset sports the Arm Mali-G720 GPU, providing 24% higher peak performance and a 42% greater power efficiency. With a capable GPU, the processor also supports the MediaTek Frame Rate Converter (MFRC) for smoother gameplay and MediaTek Adaptive Gaming Technology (MAGT 3.0) for optimizing performance.
What About The Dimensity 8400’s NPU?
“The All Big Core CPU is paired with a powerful NPU to accelerate Gen-AI tasks, along with MediaTek’s new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI applications,” writes MediaTek in the official press release.
What’s worth noting is that the processor’s NPU supports LLM, SLM, and LMMs, three different types of language models for on-device AI-enabled features, including translation, rewriting, contextual replies, and AI recording. The chipset also offers a new image sensor called the Imagiq 1080 ISP, which leverages the QPD remosaic technology.
Dimensity 8400: Connectivity Options
Regarding connectivity options, the chipset supports 5G (with a peak download speed of 5.17 Gbps), a Network Observation System (NOS), and WQHD+ support with up to 144Hz dual screen support, implying that the processor could be used to create foldables. Moreover, the chipset looks promising.
The Dimensity 8400 SoC could be seen on a smartphone by the end of this year or early next year. More details about the chipset, including the benchmark scores, should surface in a few days.
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